What is Difference Between Chip and Wafer in Electronics?

What is Difference Between Chip and Wafer in Electronics?


A chip is generally known as an Integrated Circuit, it’s an assembly of electrical parts which are made in one unit, however a wafer represents small slices of silicon which are utilized in the production of integrated circuits like the integrated circuits are used in most wafers.

An integrated circuit is called a microchip, it’s a small electrical product which is a package of circuits, pathways, and also transistors etc., most performing to each other to do a specific task or even may perhaps be a number of tasks. The microchips are the backbones for many of the latest electrical products such as microprocessors, sound as well as video instruments and also vehicles. The integrated circuit is used in the wafer. A microchip includes electrical materials such as transistors. They are utilized for giving the logic circuitry.



A microchip is usually produced from silicon wafer. The microchips are of many types. CPU microchips are generally known as microprocessors.

In electronic devices, a wafer is usually referred to as a slice as well as substrate. it’s a small slice of semiconductor components and this slice is utilized for the manufacturing of integrated circuits. It performs just like a base where an integrated circuit is usually produced. All these small slices are considered as heart of electrical products. The microcircuits on the wafers are manufactured by the diffusion and also deposition of several materials. The ever-growing trade of electronic products usually tends to form smaller microchips which are more powerful and economically less expensive as compared to the previous versions.

Raw silicon is changed into one crystal substrate by using several procedures. Many of the silicon is manufactured by reducing of SiO2 with carbon and therefore, industrial brown Metallurgical Grade Silicon is produced. This also ought to be even more refined and thus MG-Si is reacted with Hcl to get TCS. This procedure will be able to take out pollutants such as Fe, Al and also B. After that, with the method of crystal growing, the product samples with a single crystal orientation are produced. Later on by using monocrystalline seed, a rounded crystal is produced. Small slices of the crystal are produced and also those slices are referred as wafers. Later the growth procedure happens and finally the several equipments are utilized in order to get the preferred features such as shapes, etc.. Wafers are available in many diameters.

The difference between a wafer and microchip resides in the relation between them. A wafer acts as a base for chip or chip is embedded in the wafer. They together form the important unit that is widely used in the world of electronics.

WaferPro is one of the largest semiconductor & electronic material supplier company which provide Prime and Test silicon wafers that adhere to SEMI standards in a variety of diameters from 2″ to 12″ (300mm).

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